Semiconductor Engineering

The Need For 3D IC Packaging And Design Evolution

If you are familiar with Moore’s Law, you’ve probably read pronouncements that the premise of transistor counts doubling each year is reaching a wall due to complex process technologies and device ...
Design-Reuse

GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package

WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die ...
Semiconductor Engineering

Design Flow Challenged By 3D-IC Process, Thermal Variation

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...
WIVB-TV

SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE(TM) Layer Transfer Process

SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE (TM) Layer Transfer Process News provided by EIN Presswire Mar 02, 2023, 9:00 PM ET SiGen Extends Application ...
WREG

Silicon Genesis extends its NANOCLEAVE™ Layer Transfer Process for 3DIC Integration to Interconnect Network Layers

Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...
WNCT

SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE(TM) Layer Transfer Process

SiGen has been actively developing 3DIC process technology for over seven years including several applications for CMOS Image Sensors (CIS). This promising development has the potential for ...