The quest for ever-higher power densities has encouraged the rise of breathtaking levels of active/passive device integration and cool-running packaging technology. Advanced packaging technologies are ...

Electronic packaging encapsulates intricate systems whose reliability is critically affected by moisture diffusion and the resultant delamination at material interfaces. As water molecules permeate ...

Chiplets have generated a lot of interest in recent years as design engineers look for alternatives to traditional system-on-chip technology to house complex, multi-function electronics. At the ...

What are the eight general provisions? How implementing eco-design brings both similarities and differences between products and components. How you can use available tools and methods to help assess ...

New subsidiary to focus on advanced semiconductor packaging for defence and strategic electronics – Paras would be setting up India’s first advanced heterogeneous & 3D packaging ...

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...

A new technical paper titled “Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling” was published by researchers at University of Illinois, Urbana, University ...