The rollout of extreme ultraviolet (EUV) lithography could be hit by the increasing power requirements of the technology.

Leading-edge semiconductor fabs to consume 54,000 Gigawatts a year by 2030, which is more than some countries consume today.

TSMC will receive its first ASML’s most advanced High NA EUV (High Numerical Aperture Extreme Ultraviolet) lithography ...

Nikkei Asia's sources say that Taiwan Semiconductor Manufacturing Corporation (TSMC), the largest semiconductor fab in the ...

Taiwan's TSMC is likely to be the second chip-making company after Intel to receive the <a target=_blank href= ...

In October 2019, SK Hynix developed 1Znm 16GB (Gigabits) DDR4 (Double Data Rate 4) DRAM. As 16 GB is the industry’s largest ...

According to a recent TechInsights report, fabs equipped with EUV tools could see electricity consumption exceed 54,000 ...

The new R&D facility in Albany, NY will be home to the Extreme Ultraviolet (EUV) Accelerator project, which is being funded to advance leading-edge lithography research and adoption in the US. EUV ...

Learn more about the soon-to-be-built EUV Accelerator facility and its significance to the semiconductor industry.

Enhancing EUV Lithography Materials Production in Japan and South KoreaTOKYO - October 29, 2024 — FUJIFILM Corporation announced the sales of ...

A semiconductor research center in Albany, New York, has been selected to receive up to $825 million in federal funding ...

Chipmaker TSMC is expected to receive the first shipment of High Numerical Aperture NA Extreme Ultraviolet (High NA EUV) ...