The rollout of extreme ultraviolet (EUV) lithography could be hit by the increasing power requirements of the technology.
Leading-edge semiconductor fabs to consume 54,000 Gigawatts a year by 2030, which is more than some countries consume today.
In October 2019, SK Hynix developed 1Znm 16GB (Gigabits) DDR4 (Double Data Rate 4) DRAM. As 16 GB is the industry’s largest ...
Chipmaker TSMC is expected to receive the first shipment of High Numerical Aperture NA Extreme Ultraviolet (High NA EUV) ...
Taiwan's TSMC is likely to be the second chip-making company after Intel to receive the <a target=_blank href= ...
NY Creates, a non-profit that owns and operates research centers across New York, has been awarded $825 million in CHIPS and ...
Nikkei Asia's sources say that Taiwan Semiconductor Manufacturing Corporation (TSMC), the largest semiconductor fab in the ...
The new R&D facility in Albany, NY will be home to the Extreme Ultraviolet (EUV) Accelerator project, which is being funded to advance leading-edge lithography research and adoption in the US. EUV ...
Oregon and Intel were passed over for an $825M chip research center award, but officials say the state remains a strong ...
Enhancing EUV Lithography Materials Production in Japan and South KoreaTOKYO - October 29, 2024 — FUJIFILM Corporation announced the sales of ...
A semiconductor research center in Albany, New York, has been selected to receive up to $825 million in federal funding ...
At this time, I would like to welcome everyone to Novanta Incorporated's Third Quarter 2024 Earnings Call. All lines have been placed on mute to prevent any background noise. After the speakers' ...