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6d
Zacks Investment Research on MSNCadence Unveils HBM4 IP Memory System Solution for AI & HPC SystemsCadence Design Systems, Inc. CDNS recently launched an HBM4 memory IP solution, which delivers an impressive 12.8Gbps data ...
The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.
TSMC Unveils A14 Process and System on Wafer-X: A Leap Forward for AI and High-Performance Computing
Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, has announced a groundbreaking ...
In a joint developer track session with Imagination Technologies and Andes Technology, Baya chief software architect Dr. Eric ...
Cadence (Nasdaq: CDNS) today announced what it said is the industry’s first DDR5 12.8Gbps MRDIMM Gen2 memory IP system ...
JEDEC has announced the publication of its HBM4 standard: up to 8Gb/s across a 2048-bit memory interface, HBM4 offers up to ...
Addressing the growing use of AI and high-performance computing, JEDEC has published a new high-bandwidth memory (HBM) DRAM ...
5d
Zacks Investment Research on MSNCDNS Powers AI Memory With Industry-First DDR5 12.8Gbps MRDIMM Gen2 IPCadence Design Systems, Inc. CDNS recently launched the industry’s first DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution, designed on the advanced TSMC N3 process node. This leading-edge memory ...
G.SKILL unveils new overclocked, ultra-capacity 256GB (4 x 64GB) memory kit at DDR5-6000 CL32 speeds, overclocked at up to ...
The FPGA combines HBM with DDR5 and LPDDR5 support, enabling memory bandwidth and efficiency for AI and video processing ...
A game-changer for future computing, SK hynix’s new DDR5 module gets the green light from leading tech partners.
The new kit runs at 6000 MT/s with a CL32 latency and supports AMD's Extended Profiles for Overclocking (EXPO), allowing for ...
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