Wirebond package,lower cost package with lesser IO density always impose challenge for FPGA designer to meet the required power parameteric budget.This paper will share 5 watch outs on wirebond chip ...
August 18, 2009 -- Faraday Technology Corporation (TAIEX: 3035) today announced the availability of its innovative miniIOâ„¢ at 55nm and 65nm. Compared with general IO pads, Faraday's miniIOâ„¢ ...
The chip is more compact than other solutions on the market and can be mounted on smaller PCBs slapped on IO-Link devices. With its advanced protection features, the chip can also be used to cut out ...
Faraday Technology has announced the availability of its miniIO at 55nm and 65nm. Compared with general IO pads, Faraday's miniIO reduces the chip area by up to 40% for a pad-limited design with 500 ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback