The Chinese government is promoting two new lithography machines to reduce reliance on foreign chipmaking tools amid U.S.
TSMC will receive its first ASML’s most advanced High NA EUV (High Numerical Aperture Extreme Ultraviolet) lithography ...
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lithography equipment called "argon fluoride lithography machine," with core technical specifications of "300mm wafer diameter, 248nm illumination wavelength, resolution below 65nm, and alignment ...
Chipmaker TSMC is expected to receive the first shipment of High Numerical Aperture NA Extreme Ultraviolet (High NA EUV) ...