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ROHM Semiconductor announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for ...
ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package ...
Compact high heat dissipation design sets a new standard for OBCs ROHM's new 4-in-1 and 6-in-1 SiC Molded Modules in the ...
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