TSMC will receive its first ASML’s most advanced High NA EUV (High Numerical Aperture Extreme Ultraviolet) lithography ...

Extreme ultraviolet lithography is one of the top next-generation lithography (NGL) methods used to print lines as thin as 30 nm and produce microprocessors and microchips. This technique might ...

EUV is a type of photolithography that uses 13.5 nm extreme ultraviolet light from a laser-pulsed tin ... and critical resources,” the administration said. EUV lithography is essential for ...

Oregon and Intel were passed over for an $825M chip research center award, but officials say the state remains a strong ...

Chipmaker TSMC is expected to receive the first shipment of High Numerical Aperture NA Extreme Ultraviolet (High NA EUV) ...

In October 2019, SK Hynix developed 1Znm 16GB (Gigabits) DDR4 (Double Data Rate 4) DRAM. As 16 GB is the industry’s largest ...

The Sunnyvale, California location is the second flagship research and development facility announced under the 2022 CHIPS ...

U.S. Sen. Chuck Schumer says a semiconductor research facility in upstate New York will be getting $825 million in funding as one of three national technology centers. Schumer on Thursday announced th ...

Extreme ultraviolet (EUV) lithography is the next step in this trend. It uses radiation of wavelength 13.5 nm, thereby offering significant potential to extend the resolution of photolithography.

The rollout of extreme ultraviolet (EUV) lithography could be hit by the increasing power requirements of the technology.