Initial 2nm wafers will arrive at TSMC's Hsinchu plant in April. Production capacity is expected to reach 50,000 wafers monthly by year-end. TSMC's bleeding-edge 2nm process node technology is ...

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...

But the test wafers suggest that Intel is on pace, or maybe even a bit ahead of schedule, for producing 1.8nm-class chips in the middle of this year. If Intel can prove wrong the rumors about it ...

TechPowerUp, citing Intel’s engineering manager Pankaj Marria, reports that initial 18A wafers are already rolling out from the Arizona plant. The progress, according to ijiwei and Commercial Times, ...

Another interesting trend according to Fischer is the increased market share of rectangular wafers both in the 182mm size (M10R) and 210 mm size (G12R). “This is interesting to see, especially ...