What chip industry engineers were watching this year.
Reducing Write Latency of DDR5 Memory by Exploiting Bank-Parallelism” was published by Georgia Tech. Abstract “This paper studies the impact of DRAM writes on DDR5-based system. To efficiently perform ...
Fast, Low-Resistance Nano Gap Electromechanical Switch for Power Gating Applications” was published by researchers at KAIST and Chonnam National University. Abstract “The growing demand for artificial ...
A new technical paper titled “Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy” was published by researchers at ...
The move from planar SoCs to advanced packages can improve performance and provide flexibility in large designs, which are difficult to fit onto a single reticle-sized die. But ensuring the device ...
Cadence’s Jakob Engblom shares highlights from the recent SDV Europe conference, including why software-defined vehicles will require much closer, faster collaboration between suppliers and customers, ...
How Calibre nmDRC Recon enables early-stage, shift-left verification to reduce IC design runtimes and hardware requirements. How localized checks streamline debugging and accelerate design iterations.
Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.
A new technical paper titled “Effects of Proton Radiation on Tin Oxide: Implications for Space Electronics” was published by ...
Driven On-Chip Integration for High Density and Low Cost” was published by researchers at University of Southern California.
In today’s fast-paced electronics design automation (EDA) environment, effective data management has become essential.
Using AI and machine learning as transformative solutions for semiconductor device modeling and parameter extraction.
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