Polishing Equipment), Wafer Size (200 mm Wafers, 300 mm Wafers, 450 mm Wafers), Application, End-user - Global Forecast 2025-2030" report has been added to ResearchAndMarkets.com's offering.

However, migrating to 300-mm wafers requires significantly higher bond forces compared to 200-mm wafers to ensure the same bond pressure over a much larger surface area. EVG’s next-generation GEMINI ...

Tongwei says it will bring in strategic investors for its polysilicon subsidiary, Sichuan Yongxiang Co., raising CNY 10 ...

Today, SiC accounts for the majority of the revenue generated by compound semiconductor power electronics, and sales are forecast to continue to climb, as many of the leading suppliers expand their ...

A startup is developing a laser-based cooling system using ultrapure gallium arsenide plates to target chip hotspots, but at ...

China's latest export restrictions on Scandium and Dysprosium threaten to disrupt global supply chains for major tech players ...

The electronics required to control the ion-sensitive field effect transistors (ISFET) have been successfully miniaturized. At the same time, manufacturing costs and power consumption have been ...

It has doubled down on a 200-millimeter silicon carbide fab, which improves efficiency and production capacity. Shares of the Durham, North Carolina-based company slipped about 2 per cent in early ...

Researchers in China have sought to increase the efficiency of heterojunction solar cell through a buffer layer made of indium tin oxide. This innovation reportedly resulted in a 0.1% efficiency ...