TSMC will receive its first ASML’s most advanced High NA EUV (High Numerical Aperture Extreme Ultraviolet) lithography ...

The rollout of extreme ultraviolet (EUV) lithography could be hit by the increasing power requirements of the technology.

Taiwan's TSMC is likely to be the second chip-making company after Intel to receive the <a target=_blank href= ...

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In October 2019, SK Hynix developed 1Znm 16GB (Gigabits) DDR4 (Double Data Rate 4) DRAM. As 16 GB is the industry’s largest ...

Chipmaker TSMC is expected to receive the first shipment of High Numerical Aperture NA Extreme Ultraviolet (High NA EUV) ...

Facilities include NY CREATES’s Albany NanoTech Complex and administrative headquarters for the NSTC in Sunnyvale CA ...

Leading-edge semiconductor fabs to consume 54,000 Gigawatts a year by 2030, which is more than some countries consume today.

The new R&D facility in Albany, NY will be home to the Extreme Ultraviolet (EUV) Accelerator project, which is being funded to advance leading-edge lithography research and adoption in the US. EUV ...

Learn more about the soon-to-be-built EUV Accelerator facility and its significance to the semiconductor industry.

According to a recent TechInsights report, fabs equipped with EUV tools could see electricity consumption exceed 54,000 ...

Oregon and Intel were passed over for an $825M chip research center award, but officials say the state remains a strong ...