Abstract: The detailed temperature field distribution of high-power insulated gate bipolar transistor (IGBT) modules is important information for the reliability analysis and thermal design of power ...
The IPOSIM from Infineon is widely used to calculate losses and thermal behaviour of power modules, discrete devices, and ...
Abstract: This study deals with the integration of Rogowski sensor into power module using 3D printing for the coil former and the custom-designed casing. The sensor design is done considering the ...
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