Read more here. Fig.1: Wafer map of a failure mode detected by an in-line DFI filler cell scan on an excursion wafer. Source: PDF Solutions.

He hasn't really told us yet what this means The admission came toward the end of a roughly an hour-and-a-half-long product strategy update that was dominated more by customer testimonials than ...

Wafer singulation (a.k.a. dicing), with wafer map providing data on pass/fail die locations; Assembly process results in packaged product, and Packaged part testing, where package bumps or pins ...