Abstract: A novel wafer-level 3DIC structure named SoW-X (System-On-Wafer, eXtreme) is proposed to enable integration of up to 16 full-reticle sized ASICs, 80 HBM4 modules and 2.8K 224Gb/s long ranged ...
Teams are embedding MCP into their workflows to supercharge development. By linking MCP servers to internal Git environments, they create a “Git bridge” that gives AI direct context on their codebase, ...
Qualcomm had datacenter envy back when Intel ruled the bit barns of the world, and now it has it even worse now that Nvidia ...
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