TSMC will receive its first ASML’s most advanced High NA EUV (High Numerical Aperture Extreme Ultraviolet) lithography ...
EUV is a type of photolithography that uses 13.5 nm extreme ultraviolet light from a laser-pulsed tin ... and critical resources,” the administration said. EUV lithography is essential for ...
The rollout of extreme ultraviolet (EUV) lithography could be hit by the increasing power requirements of the technology.
Chipmaker TSMC is expected to receive the first shipment of High Numerical Aperture NA Extreme Ultraviolet (High NA EUV) ...
Oregon and Intel were passed over for an $825M chip research center award, but officials say the state remains a strong ...
According to a recent TechInsights report, fabs equipped with EUV tools could see electricity consumption exceed 54,000 ...
Researchers in China have created a highly sensitive cationic epoxy photoresist, named TP-EO, that significantly enhances the speed and resolution of two-photon laser direct writing lithography (TPL).
The Sunnyvale, California location is the second flagship research and development facility announced under the 2022 CHIPS ...
A semiconductor research center in Albany, New York, has been selected to receive up to $825 million in federal funding ...
Leading-edge semiconductor fabs to consume 54,000 Gigawatts a year by 2030, which is more than some countries consume today.
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