Disco Co. (OTCMKTS:DSCSY – Get Free Report) saw a significant decline in short interest in the month of February. As of February 28th, there was short interest totalling 7,700 shares, a decline of 13.

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

I f you're a dessert-lover like me, you probably have favorites in every sweets category. Peanut butter no-bakes are my go-to ...

Department of Mechanical Engineering, 271 Applied Science Complex II, Iowa State University, Ames, Iowa 50011, United States ...

The structure was successfully realized, achieving a 100% dicing yield of bonded wafers. For the 12 tested samples, the min, max, average, and standard deviation of die shear strength are 18.3, 40.1, ...

A SEMICONDUCTOR CHIP WAFER PRIOR TO DICING. SIZE THE TIP OF YOUR FINGER CONNECTING CHIPS WITH GOLD WIRES ONE THIRD THE WIDTH OF A HUMAN HAIR. HERE’S A BOOT CAMP BONDER WE’RE GOING TO TALK ...

However, not all chips perform equally, even if they come from the same wafer. This is where chip binning comes in. After dicing, each die is tested and sorted based on factors like speed ...

wafer dicing/scribing, die bonding, and final test. While their broad application across front-end and back-end processes makes them an essential supplier, their reliance on semiconductor equipment ...

The company uses these systems for research and development purposes, and so far, Intel has processed tens of thousands of wafers using them. Intel installed and started using two High-NA EUV ...

This goes back to 2022, when the two companies announced their collaboration, promising to start wafer production in 2025. It seems that everything went according to the plans, because, as Reuters ...

The government and industry groups are working on reducing power and water costs as they aspire to put up the first wafer fabrication facility in the country and meet the “evolving” demands of ...