A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

Critical IC mineral concerns; wafer shipments shrink; Europe bets big on AI; new ultrasonic cleaner; high-speed DRAM test; ...

Signal integrity in chiplets; normalizing AI data; multi-physics definitions; CXL, compression; simulation data management; SMP; vision-enabled devices.

Maura Callahan is a senior product marketing manager at Ansys. She focuses on Digital Mission Engineering and Simulation Process Data Management product portfolios. Before joining Ansys, she worked at ...

Enhanced Performance: Integrating compression with CXL allows for efficient data movement, reducing system latency and power consumption. This is particularly beneficial for AI and machine learning ...

Chiplet design engineers have complex new considerations compared to PCB concepts. Maintaining the quality and reliability of ...

Linear normalization, which is most common, involves shifting the number axis so the data is balanced around zero, and then ...

Enabling devices to perceive and interpret their surroundings in a more sophisticated manner.

How to detect hard-to-find leakage issues across power domains.

Multi-physics is the new buzzword in semiconductor design and analysis, but the fuzziness of the term is a reflection of just how many new and existing problems need to be addressed simultaneously in ...