At electronica 2026 in Munich, EE Times talks with Lars Reger, CTO of NXP Semiconductors, about the physical AI era and how ...
STMicroelectronics’ Maria Heriz explains why the company is unifying its MCUs on one STM32 platform, plus CRA, RISC-V, and physical AI.
In this partner interview, Credo’s Don Barnetson explains how micro-emitter optics and the 1.6T ZeroFlap ALC deliver reliable ...
The question isn’t whether Saskatchewan can do everything; it’s how well it can connect and scale up its existing strengths.
Voters backed limits on data centers in 40 of 41 local votes. Who pays for AI’s power grid? Compare U.S. and China’s ...
Chang Ming delivers scarce semiconductors, with rigorous 9-step quality inspection & global supply chain support for European ...
Can it really be true that someone with Jensen Huang’s intelligence, experience, and judgment got caught by a honey trap, ...
In this partner edition of Silicon Grapevine, BIWIN’s Henry Luo explains why storage matters more in the AI era and how the ...
In this partner interview, Celestica and Broadcom explain how co-packaged optics cut power and latency to scale AI data ...
European companies hold half the SiC device market but invest most of their SiC money abroad. What that means for a new fab ...
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