Design And Reuse, The System-On-Chip Design Resource - IP, …
Camera 3DNR IP. Compact, low-power, 8bit ADC on GF 22nm FDX. 224G Ethernet PHY IP for TSMC N3P. ARINC 429 IP. PVT - Process, Voltage, and Temperature Monitor with Interrupt ... 40 mA LDO voltage regulator (3.3/5.0V to 1.8V) on TSMC 180nm ... 40G UCIe PHY IP on Samsung SF4X. Flip-Chip compatible I/O Library in Dongbu HiTek 130nm with ...
D&R Silicon IP Catalog: Directory of Semiconductor IP - Design …
D&R provides the world's largest directory of Silicon IP (Intellectual Property), SoC Configurable Design Platforms and SOPC Products from 400 vendors
SRC-Pro : 24-bit -130dB THD+N Multi-Channel Audio …
The ASRC-pro can perform common sample rate conversions with less than -130 dB of Total Harmonic Distortion plus Noise (THD+N) and has a Dynamic range of 131 dB, supporting input data processing of up to 24-bit resolution. Coreworks ASRC series are implemented to support several key industry interfaces: TDM parallel, TDM serial, Parallel, I 2 S ...
Design Rule Checks (DRC) - A Practical View for 28nm Technology
This whole process is called Design Rule Checking (DRC). There are many design rules at different technology nodes, a few of which are mentioned below. Types of DRCs: Minimum width and spacing for metal. Minimum width and spacing for via. Fat wire Via keep out Enclosure. End of Line spacing. Minimum area.
System Verilog Assertions Simplified - Design And Reuse
System Verilog Assertions Simplified. By Smit Patel, eInfochips. Abstract. Assertion is a very powerful feature of System Verilog HVL (Hardware Verification Language). Nowadays it is widely adopted and used in most of the design verification projects. This article explains the concurrent assertions syntaxes, simple examples of their usage and ...
Understanding the Importance of Prerequisites in the VLSI Physical ...
At the heart of VLSI lies the intricate process of physical design, a crucial step that transforms logical circuit representations into tangible semiconductor chips. This article delves into the significance of different prerequisites of physical design in VLSI, highlighting its multifaceted importance and the intricacies of the process.
USB Promoter Group Announces USB Power Delivery Specification …
May 26, 2021 · Specification defines delivering up to 240W of power over USB Type-C® Beaverton, OR, USA – May 26, 2021 – The USB Promoter Group today announced the release of the USB Power Delivery (USB PD) Revision 3.1 specification, a major update to enable delivering up to 240W of power over the USB Type-C® cable and connector. Prior to this update, USB PD was limited to 100W via a solution based on ...
GUC Taped Out UCIe 32G IP using TSMC's 3nm and CoWoS …
Jan 9, 2024 · UCIe 32G chiplet interface provides industry leading bandwidth density 10 Tbps per 1mm of die edge (5 Tbps/mm full-duplex). The chip uses TSMC’s N3P silicon process and CoWoS ® advanced packaging technology. In recent years GUC has developed a family of chiplet interconnect IPs (GLink-2.5D) in TSMC N7, N5 and N3 process nodes.
ARC Functional Safety Processor Software IP Core - Design …
The functional safety (FuSa) software components in conjunction with Synopsys’ ASIL certified MetaWare Development Tools for Safety and industry leading ARC® FS processors provide comprehensive ASIL compliant solutions which dramatically reduce customers’ risk and SoC certification effort. The FuSa software portfolio supports of a number ...
MosChip Technologies joins Renesas RZ Partner Ecosystem as …
Santa Clara, USA -- October 21st, 2024 – MosChip® Technologies is now an AI/ML design partner under Renesas RZ partner ecosystems, delivering intelligent solutions based on Renesas RZ/V series of MPUs.. MosChip® Technologies is a semiconductor design and product engineering services company with expertise in SoC design, systems, software, mobility, connectivity, vision, AI/ML and GenAI ...